20th
TECHNICAL FORUM
Presentation by KOMSCO
Fabrication technology of lightweight, high relief thin coin with large area
Summary
Lightweight, high relief thin coin was produced by cold press. Generally, high relief coin requires sufficient weight of material to provide adequate deformation. In addition, excessively thin thickness causes an unnecessary deformation trace on the back side, corresponding to the pattern on the front side. However, 2.6 mm relief and ~1.2 mm thickness were realized in the Φ60, 1.23 oz Ag coin. The primary key was fabrication of sintered Ag blank with optimized specification.
Speaker: Jaeick Kim
Education
March 2012 – August 2019
Ph.D. in Material Science and Engineering, Hanyang University
March 2008 – February 2012
B.S. in Material Science and Engineering, Hanyang University
Current affiliation
Researcher of minting technology
Technology Research Institute of KOMSCO (Korea Minting, Security Printing & ID Card Operating Corp.)